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Block

1.Fixed compression stroke

2.Low pin counts(< 200 Pins)

3.Simple structure

4.Cheaper

4.Suit for QFN and QFP package


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Knob

1.Flexible compression stroke

2.Complex structure

3.More expensive

4.Suit for all kind of package


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Heat Sink

1.With heat sink

2.Applied for High power IC 

(Heating temperature from 80℃ to 200℃)


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Cooling Fan

1.With extra cooling fan

2.Applied for High power IC 

(Heating temperature above 200℃)


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